Chang Wook Lee, Yeonjung Hwang, Uk Heo, Byung Gil Yoo, Ji Hong Yoo, Taejeong Kim, Kwang Min Yoon이창욱, 황연정, 허욱, 유병길, 유지홍, 김태정, 윤광민
Korean J. Met. Mater. 2022;60(11):801-810. Published online 2022 Oct 31
DOI:
https://doi.org/10.3365/KJMM.2022.60.11.801
Abstract
Hot stamping technology has been steadily developed because it provides both excellent formability and high strength. With the development of TWB hot stamping technology, it is now possible to freely apply the required strength and thickness in the right place. In this study, the microstructure and collision performance of TWB.....
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