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The Effect of Ni Interlayer Formation Plating Bath on the Suppression of Oxidation of Ag-Coated Cu Flakes
Ag 코팅 Cu 플레이크의 산화 억제에 미치는 Ni interlayer 형성 도금욕의 영향
Ji Hwan Kim, Jong-Hyun Lee
김지환, 이종현
Korean J. Met. Mater. 2023;61(10):748-759.   Published online 2023 Sep 25
DOI: https://doi.org/10.3365/KJMM.2023.61.10.748

To suppress Ag dewetting from around 200 oC in Ag-coated Cu (Cu@Ag) flakes, Ag and Ni-coated Cu (Cu@Ni@Ag) flakes were fabricated by successive Ni and Ag electroless plating. The Ni bath type was an important consideration to induce differences in the Ag dewetting and resultant Cu oxidation. An acid Ni..... More

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