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Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
고전류밀도에서 유기첨가제에 의한 구리 전착층의 전기적 특성 변화
Tae-Gyu Woo, Il-Song Park
우태규, 박일송
Korean J. Met. Mater. 2020;58(1):41-48.   Published online 2019 Dec 12
DOI: https://doi.org/10.3365/KJMM.2020.58.1.41

Abstract
Electroplating has many economic advantages in producing copper foils. The easiest way to manufacture electroplated copper foil with various properties is to add appropriate additives. This study evaluated the surface properties, mechanical and electrical properties of copper foil electroplated in electrolytes containing the leveler JGB (Janus Green B). When the..... More

                   Web of Science 8  Crossref 6
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