Abstract
To suppress Ag dewetting from around 200 ^oC in Ag-coated Cu (Cu@Ag) flakes, Ag and Ni-coated Cu (Cu@Ni@Ag) flakes were fabricated by successive Ni and Ag electroless plating. The Ni bath type was an important consideration to induce differences in the Ag dewetting and resultant Cu oxidation. An acid Ni..... More