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Korean J. Met. Mater.
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Korean Journal of Metals and Materials
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Sn 조성 변화가 Cu-Sn 브레이징 접합부의 응고조직과 균열에 미치는 영향
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문병록, 유성훈, 이병휘, 홍원식, 정진욱, 강남현
Korean J. Met. Mater.
2025;63(5):370-379. Published online 2025 May 5
DOI:
https://doi.org/10.3365/KJMM.2025.63.5.370
Abstract
Solidification cracking in brazed joints is significantly influenced by solidification conditions and alloy composition, making it a critical factor for the reliability of parts and products. Numerous studies have been conducted to predict solidification cracking in processes like casting, welding, and joining, leading to the development of an index to.....
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Bi가 첨가된 Sn-2.5Ag-0.8Cu-0.05Ni-1Bi 및 Sn-0.75Cu-0.065Ni-1.5Bi 솔더 합금의 응고 거동 및 기계적 특성과 형성 접합부의 미세구조
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이혜민, 문정탁, 이영우, 김휘중, 이슬기, 이종현
Korean J. Met. Mater.
2024;62(7):511-523. Published online 2024 Jun 28
DOI:
https://doi.org/10.3365/KJMM.2024.62.7.511
Abstract
To form excellent solder joints in both thermal cycling and drop tests, Sn-2.5Ag-0.8Cu-0.05Ni-1Bi and Sn-0.75Cu-0.065Ni-1.5Bi composition solder balls were developed. In this study, undercooling and solidification characteristics of the alloys, resulting microstructural changes, the solid solution effect of Bi, physical properties, and interfacial reaction properties were investigated and compared with.....
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Web of Science 1
Crossref 1
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Sn 도금을 통한 PCB 기판상의 솔더 범프 제작 및 미세조직 분석
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김상혁, 김성진, 신한균, 박현, 허철호, 문성재, 이효종
Korean J. Met. Mater.
2021;59(4):233-238. Published online 2021 Mar 24
DOI:
https://doi.org/10.3365/KJMM.2021.59.4.233
Abstract
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM.....
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Web of Science 2
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전류밀도에 따른 플립칩 Sn-Ag 솔더 범프의 Electromigration 손상기구 분석
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김가희, 손기락, 박규태, 박영배
Korean J. Met. Mater.
2017;55(11):798-805. Published online 2017 Oct 31
DOI:
https://doi.org/10.3365/KJMM.2017.55.11.798
Abstract
The effect of current densities on the electromigration (EM) failure mechanism of flip chip Cu/Ni/Sn-Ag/Cu solder bumps was investigated under stressing conditions at current densities ranging from 5.0~6.9 × 10
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at 150 ℃. The EM failure times at 5.0 × 10
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were around 11 times longer than at.....
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자동차 에어백용 플렉시블 충격센서 모듈의 솔더 접합부 피로수명
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박지연, 김미송, 오철민, 도상현, 서종덕, 김대근, 홍원식
Korean J. Met. Mater.
2017;55(4):232-239. Published online 2017 Apr 6
DOI:
https://doi.org/10.3365/KJMM.2017.55.4.232
Abstract
To improve the sensitivity of impact sensor modules for automotive air bag systems, we developed a flexible module. The impact sensor was soldered with Sn-3.0Ag-0.5Cu (SAC305) solder on a flexible printed circuit board (FPCB) with an organic solderability preservative (OSP) surface finish. Thermal shock (TS) is one of the test.....
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Crossref 8
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Cu-Sn계 솔더와 기판 사이의 Ni층의 두께와 열처리 시간에 따른 금속간화합물의 기계적 특성
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김이슬, 권지혜, 유다영, 박성규, 이다정, 이동윤
Korean J. Met. Mater.
2017;55(3):165-172. Published online 2017 Mar 3
DOI:
https://doi.org/10.3365/KJMM.2017.55.3.165
Abstract
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion.....
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Crossref 2
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Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측
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허민혁, 강남현, 박성훈, 김준기, 홍원식
Korean J. Met. Mater.
2016;54(12):908-915. Published online 2016 Dec 5
DOI:
https://doi.org/10.3365/KJMM.2016.54.12.908
Abstract
The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly.....
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Crossref 4
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