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Effects of Au Bump Process Condition on the Interfacial Reaction and Mechanical Reliability of Non-cyanide Au Bump for Display Driver IC Bonding
디스플레이 구동 칩 접합을 위한 시안화물이 포함되지 않은 Au 범프 공정 조건이 계면 반응 및 기계적 신뢰성에 미치는 영향
Hyejin Kim, Gahui Kim, Yong-Ho Ko, Chul-min Baek, Joo-Hyeon Park, Young-Bae Park
김혜진, 김가희, 고용호, 백철민, 박주현, 박영배
Korean J. Met. Mater. 2024;62(9):726-734.   Published online 2024 Sep 5
DOI: https://doi.org/10.3365/KJMM.2024.62.9.726

Abstract
The effects of annealing temperature and thermal cycle conditions on the adhesion characteristics of non-cyanide Si/sputter TiW/sputter Au/Au bump structure were systematically investigated using a shear test. No intermetallic compound was observed at the TiW/Au interface at all annealing temperatures, and voids formed between the TiW and Au bump interface..... More

                
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