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Effect of Ni and Cu Addition on Corrosion Behaviors of Pre-Oxidized Ultra-Strong Steel for Automotive Applications
Ni 및 Cu 첨가가 고온 산화된 자동차용 초고강도 강재의 부식 거동에 미치는 영향
Seung Min Ryu, Hwan Goo Seong, Jeong Kil Kim, Joong-Ki Hwang, Man Jae Lee, Min-Suk Oh, Sung Jin Kim
류승민, 성환구, 김정길, 황중기, 이만재, 오민석, 김성진
Korean J. Met. Mater. 2019;57(6):343-351.   Published online 2019 May 16
DOI: https://doi.org/10.3365/KJMM.2019.57.6.343

The incomplete elimination of oxide scale formed during the normalizing process can result in severe degradation of the surface and mechanical properties of ultra-strong steels. This study revealed that the formation of oxide scale was highly dependent upon the alloying elements Ni and Cu. Ni-bearing steel showed a much higher..... More

Optimization of Flexible, Transparent TiO<sub>2</sub>/Cu/ZnO Electrodes by Simultaneous Suppression of Optoelectrical Losses and Pinhole Formation
광전 손실과 핀홀 생성의 억제를 통한 유연 투명 TiO2/Cu/ZnO 전극의 최적화 연구
Eunwook Jeong, Gun-Hwan Lee, Young-Rae Cho, Jungheum Yun
정은욱, 이건환, 조영래, 윤정흠
Korean J. Met. Mater. 2019;57(5):316-323.   Published online 2019 Apr 10
DOI: https://doi.org/10.3365/KJMM.2019.57.5.316

We demonstrated an effective method for fabricating a highly efficient flexible transparent electrode in an oxide/metal/oxide configuration based on an ultrathin Cu film. It exhibited low losses in optical transmittance and electrical conductivity while minimizing current loss due to pinhole-related leakages. The Cu film was developed on a chemically heterogeneous..... More

Flexible OLED Encapsulation with LMPA Line
저융점합금 라인을 이용한 플렉시블 OLED 봉지
Geon Bae, Cheol-Hee Moon
배건, 문철희
Korean J. Met. Mater. 2019;57(4):251-257.   Published online 2019 Apr 5
DOI: https://doi.org/10.3365/KJMM.2019.57.4.251

We have developed an encapsulation technology for OLED devices using an LMPA sealing line to enhance barrier characteristics against moisture and oxygen penetration. To verify the potential of this technology for flexible OLED devices, three experimental factors were investigated in this study. First, the stability of the sealing line on..... More

Effect of Shear Deformation During Drawing on Inhomogeneous Microstructures and Textures in High Purity Copper Wires After Annealing
고순도 구리 선재의 어닐링 후 불균질 미세조직과 집합조직에 미치는 신선 시 전단 변형의 영향
Hyun Park, Sang-Hyeok Kim, Se-Jong Kim, Hyo-Jong Lee
박현, 김상혁, 김세종, 이효종
Korean J. Met. Mater. 2018;56(12):861-869.   Published online 2018 Dec 5
DOI: https://doi.org/10.3365/KJMM.2018.56.12.861

To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using..... More

Bridge Burst Characteristics of Aluminum and Copper Thin-Film Bridges in Electrical Initiation Devices
Kyoungjin Kim, Kyu-Hyoung Kim, Seung-gyo Jang
Korean J. Met. Mater. 2018;56(3):235-243.   Published online 2018 Mar 6
DOI: https://doi.org/10.3365/KJMM.2018.56.3.235

The optimal design of electrical initiation devices for explosive charges and other high energy materials critically depends on the bridge burst or the electrical explosion of the thin-film metallic bridges. It is therefore quite important to select the right material with suitable explosion properties for the metallic bridge film. However,..... More

Material Characterization of Single Crystalline Cu Subjected to High Strain Rates and High Temperatures for Multiscale Simulation
Yujin Seong, Youngkyu Kim, Im Doo Jung, Sungho Kim, See Jo Kim, Seong-Gon Kim, Hak Jun Kim, Seong Jin Park
Korean J. Met. Mater. 2017;55(11):760-767.   Published online 2017 Oct 31
DOI: https://doi.org/10.3365/KJMM.2017.55.11.760

The material characterization of single crystalline Cu columns was numerically carried out at the submicroscopic level. A molecular dynamics (MD) simulation was employed using the embedded-atom method (EAM) interatomic potential between a pair of Cu atoms to describe the interactions among Cu atoms. First, the relationship between mechanical properties and..... More

         Cited By 1
Review of Conductive Copper Paste for c-Si Solar Cells
Sang Hee Lee, Doo Won Lee, Soo Hong Lee
Korean J. Met. Mater. 2017;55(9):637-644.   Published online 2017 Aug 30
DOI: https://doi.org/10.3365/KJMM.2017.55.9.637

In the photovoltaic industries, the main technique of metallization is screen printing with silver pastes, due to its simple and quick process. However, the high price of silver paste is one of the barriers to the producing of low cost solar cells. Consequently, a primary target in photovoltaic research is..... More

Effects of Friction and Anvil Design on Plastic Deformation during the Compression Stage of High-Pressure Torsion
Yuepeng Song, Miaomiao Chen, Baoyan Xu, Dongsheng Gao, Jing Guo, Lingfeng Xu, Zheng Wang, Hyoung Seop Kim
Korean J. Met. Mater. 2016;54(11):831-837.   Published online 2016 Nov 5
DOI: https://doi.org/10.3365/KJMM.2016.54.11.831

Herein, we report the results of our investigation on the effect of friction and anvil design on the heterogeneous plastic-deformation characteristics of copper during the compressive stage of high-pressure torsion (HPT), using the finite element method. The results indicate that the friction and anvil geometry play important roles in the..... More

         Cited By 2
Electronic Materials
The Effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) Additives on the Surface Morphology and Mechanical Properties of Electrolytic Copper Foil
전해 동박의 표면 형상 및 기계적 물성에 미치는 SPS 첨가제 영향
Tae-Gyu Woo
Korean J. Met. Mater. 2016;54(9):681-687.   Published online 2016 Sep 5
DOI: https://doi.org/10.3365/KJMM.2016.54.9.681

In this study the effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) on the elongation, surface morphology and crystal structure of electrolytic copper foil were investigated. Additives HEC (hydroxyethyl cellulose) (A), SPS(B), Coll-A(C) were used in the study, and the additive used as D was a Cl- ion. The study results show that there..... More

         Cited By 2
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