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Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil
JGB 첨가제에 의한 동박의 미세구조변화와 전기적 특성
Tae-Gyu Woo, Il-Song Park
우태규, 박일송
Korean J. Met. Mater. 2021;59(6):404-411.   Published online 2021 May 26
DOI: https://doi.org/10.3365/KJMM.2021.59.6.404

Abstract
Extremely thin film high quality copper foil is required to ensure high performance in electronics and slimness in secondary batteries. During the electroplating of copper foil, Janus Green B(JGB) and Collagen were introduced as additives to the electrolytes to study their effects. The structural and electrical properties of the electroplated..... More

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