Abstract
The effects of post-annealing times at 150°C on the bonding strength and interfacial characteristics of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Al were systematically evaluated. In the as-bonded sample, Cu₆Sn₅ intermetallic compound (IMC) was formed at the upper Cu/SAC305 interface, while Ag₃Al IMC was formed at the lower SAC305/Al interface, and a black layer of..... More

Abstract
In this study, the microstructure-controlled Zn interlayers were synthesized to improve the adhesion strength of Zn/Zn-Mg double layer coatings. The coating chamber temperature and working pressure were controlled based on the Structure Zone Model principles, to obtain a dense columnar microstructure in the Zn interlayer. By controlling the coating chamber..... More