Abstract
In this study, half-Heusler (HH) thermoelectric materials Nb_0.8Hf_0.2FeSb_0.98Sn_0.02 (p-type) and Hf_0.25Zr_0.25Ti_0.5NiSn_0.98Sb_0.02 (n-type) were synthesized using induction melting and spark plasma sintering. For alloying, a conventional induction melting technique was employed rather than arc melting, for mass production compatibility, and the thermoelectric properties of the materials were analyzed. The maximum dimensionless..... More

Abstract
Electroplating has many economic advantages in producing copper foils. The easiest way to manufacture electroplated copper foil with various properties is to add appropriate additives. This study evaluated the surface properties, mechanical and electrical properties of copper foil electroplated in electrolytes containing the leveler JGB (Janus Green B). When the..... More

Abstract
Lack of understanding on the electrical properties of the solid electrolyte interface (SEI) has been one of the major hurdles for developing fast charging Li-ion batteries. Here, we report our preliminary experimental result on the measurement of the electrical resistivity of SEI using the direct-contact technique based on electron microscopy..... More

Abstract
Severe resistivity size effect in Cu interconnects is attributed to the relatively long bulk electron mean free path (39 nm at 298 K), which is inherently determined by phonon scattering. In this regard, Ru and Co have been recently considered as attractive alternatives for next-generation interconnect materials because the significantly..... More