| Home | E-Submission/Review | Sitemap | Editorial Office |  
top_img
Korean Journal of Metals and Materials Search > Browse Articles > Search



Effects of Au Bump Process Condition on the Interfacial Reaction and Mechanical Reliability of Non-cyanide Au Bump for Display Driver IC Bonding
디스플레이 구동 칩 접합을 위한 시안화물이 포함되지 않은 Au 범프 공정 조건이 계면 반응 및 기계적 신뢰성에 미치는 영향
Hyejin Kim, Gahui Kim, Yong-Ho Ko, Chul-min Baek, Joo-Hyeon Park, Young-Bae Park
김혜진, 김가희, 고용호, 백철민, 박주현, 박영배
Korean J. Met. Mater. 2024;62(9):726-734.   Published online 2024 Sep 5
DOI: https://doi.org/10.3365/KJMM.2024.62.9.726

Abstract
The effects of annealing temperature and thermal cycle conditions on the adhesion characteristics of non-cyanide Si/sputter TiW/sputter Au/Au bump structure were systematically investigated using a shear test. No intermetallic compound was observed at the TiW/Au interface at all annealing temperatures, and voids formed between the TiW and Au bump interface..... More

                
Effects of Post-annealing Condition on Interfacial Reaction and Bonding Strength of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module Application
방열 모듈 적용을 위한 Cu/Sn-3.0Ag-0.5Cu/Al 접합부의 계면 반응 및 접합강도에 미치는 후속 열처리 영향 분석
Dong Ik Jeong, Gahui Kim, Doheon Kim, Minchul Oh, Geon-Hong Kim, Young-Bae Park
정동익, 김가희, 김도헌, 오민철, 김건홍, 박영배
Korean J. Met. Mater. 2024;62(4):312-322.   Published online 2024 Mar 28
DOI: https://doi.org/10.3365/KJMM.2024.62.4.312

Abstract
The effects of post-annealing times at 150°C on the bonding strength and interfacial characteristics of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Al were systematically evaluated. In the as-bonded sample, Cu6Sn5 intermetallic compound (IMC) was formed at the upper Cu/SAC305 interface, while Ag3Al IMC was formed at the lower SAC305/Al interface, and a black layer of..... More

                   Web of Science 1  Crossref 1
Effect of Interfacial Intermetallic Compounds Morphology on Mechanical Properties of Laser Brazing of Aluminum to Steel
Kwang-Hyeon Lee, Su-Jin Lee, In-Duck Park, Kwang-Deok Choi, Chung-Yun Kang, Jeong Suh, Tae-Jin Yoon
Korean J. Met. Mater. 2021;59(9):640-651.   Published online 2021 Aug 4
DOI: https://doi.org/10.3365/KJMM.2021.59.9.640

Abstract
The paper provides experimental details of the welding and specific examples of welding aluminum welding battery cans and conductive tabs for battery pack manufacture. In this study, we provide experimental details of a process for joining dissimilar materials used in sealing battery parts. A laser brazing technique was used for..... More

                
Studies on the Microstructure-Controlled Zn Interlayer for Improving the Adhesion Strength of the Zn/Zn-Mg Double Layer Coating
Zn/Zn-Mg 이중 층 박막의 밀착력 향상을 위한 Zn interlayer 미세구조 제어에 관한 연구
Seung-Hwan Lee, Hoe-Kun Kim, Myeon-Kyu Song, Jung-Wan Kim, Sang-Yul Lee
이승환, 김회근, 송면규, 김정완, 이상율
Korean J. Met. Mater. 2019;57(11):695-700.   Published online 2019 Nov 5
DOI: https://doi.org/10.3365/KJMM.2019.57.11.695

Abstract
In this study, the microstructure-controlled Zn interlayers were synthesized to improve the adhesion strength of Zn/Zn-Mg double layer coatings. The coating chamber temperature and working pressure were controlled based on the Structure Zone Model principles, to obtain a dense columnar microstructure in the Zn interlayer. By controlling the coating chamber..... More

                   Web of Science 2  Crossref 2
1 |
E-Submission
Email Alert
Author's Index
Specialties
Journal Impact Factor 1.1
The Korean Institute of Metals and Materials
SCImago Journal & Country Rank
Scopus
GoogleScholar
Similarity Check
Crossref Cited-by Linking
KOFST
COPE
Editorial Office
The Korean Institute of Metals and Materials
6th Fl., Seocho-daero 56-gil 38, Seocho-gu, Seoul 06633, Korea
TEL: +82-2-557-1071   FAX: +82-2-557-1080   E-mail: metal@kim.or.kr
About |  Browse Articles |  Current Issue |  For Authors and Reviewers
Copyright © The Korean Institute of Metals and Materials.                 Developed in M2PI