Abstract
The effects of annealing temperature and thermal cycle conditions on the adhesion characteristics of non-cyanide Si/sputter TiW/sputter Au/Au bump structure were systematically investigated using a shear test. No intermetallic compound was observed at the TiW/Au interface at all annealing temperatures, and voids formed between the TiW and Au bump interface..... More

Abstract
The effects of heat treatment and thermal cycle conditions on the bonding strength and interfacial characteristics of electroplated Cr/electroplated Ni-P coatings were systematically evaluated. With step1 samples, heat treatment was performed at 750 ^oC for 6 hours after successive electroplating of Ni-P and Cr layers. With step2 samples, 1st heat..... More