Ji-Yeon Park, Mi-Song Kim, Chulmin Oh, Sang Hyeon Do, Jong Dock Seo, Dae Keun Kim, Won Sik Hong박지연, 김미송, 오철민, 도상현, 서종덕, 김대근, 홍원식
Korean J. Met. Mater. 2017;55(4):232-239. Published online 2017 Apr 6
DOI:
https://doi.org/10.3365/KJMM.2017.55.4.232
Abstract
To improve the sensitivity of impact sensor modules for automotive air bag systems, we developed a flexible module. The impact sensor was soldered with Sn-3.0Ag-0.5Cu (SAC305) solder on a flexible printed circuit board (FPCB) with an organic solderability preservative (OSP) surface finish. Thermal shock (TS) is one of the test.....
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