Abstract
The use of heat dissipation materials in various field such as power semiconductor device, LED and microelectronic system. Therefore, there is a need for heat dissipation materials using copper (Cu) and graphite (Gr). These materials have high thermal conductivity. In particular, graphite has high thermal stability with a low coefficient..... More

Abstract
In this study, a high-melting point element, tantalum carbide (TaC) was added to improve the mechanical properties and the oxidation/corrosion resistance of Fe. The Fe-TaC composites were synthesized by high energy ball milling for the mechanical alloying of the non-equilibrium phase (Fe-Ta) and the homogeneous dispersion of TaC. Fe-TaC composite..... More