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Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper
Tae-Gyu Woo, Il-Song Park, Kyeong-Won Seol
Korean J. Met. Mater.. 2018;56(6):459-464. Published online 2018 Jun 4 DOI: https://doi.org/10.3365/KJMM.2018.56.6.459
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Citations to this article as recorded by
 Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
Tae-Gyu Woo, Il-Song Park
Korean Journal of Metals and Materials.2020; 58(1): 41. CrossRef
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