Structural Analysis of Three-Component Nanoparticles of Sn-58Bi and Cu Wires Prepared by Pulsed Wire Discharge
Jong Hwan Kim, Dae Sung Kim, Hisayuki Suematsu, Kenta Tanaka, Bong Ki Ryu
Korean J. Met. Mater.. 2017;55(1):72-76.   Published online 2017 Jan 5     DOI: https://doi.org/10.3365/KJMM.2017.55.1.72
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Liquid-Phase Reaction Sintering Behavior at below 200 °C and Electrical Sheet Resistance of Sn-58Bi/Cu Composite Pastes
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