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Effect of Sawing Velocity Variation on Chipping Damage of Semiconductor Wafers with Different Thicknesses
Seong-Min Lee
Korean J. Met. Mater.. 2016;54(8):598-604. Published online 2016 Aug 5 DOI: https://doi.org/10.3365/KJMM.2016.54.8.598
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Citations to this article as recorded by
 Pattern Design to Prevent Sawing-Induced Passivation Damage on Scribe Region During Semiconductor Wafer Separation
Seong-Min Lee
MATERIALS TRANSACTIONS.2018; 59(12): 1887. CrossRef Adoption of Hybrid Dicing Technique to Minimize Sawing-Induced Damage during Semiconductor Wafer Separation
Seong-Min Lee
MATERIALS TRANSACTIONS.2017; 58(4): 530. CrossRef Effect of grain size evolution in an Au-wire ball on debonding failure with the Al-pad in semiconductor devices
Seong-Min Lee, Sae-Byeul Kim
Thin Solid Films.2017; 641: 69. CrossRef
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