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Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil
Tae-Gyu Woo, Il-Song Park
Korean J. Met. Mater.. 2021;59(6):404-411. Published online 2021 May 26 DOI: https://doi.org/10.3365/KJMM.2021.59.6.404
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