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Korean Journal of Metals and Materials > Volume 56(5); 2018 > Article
Korean Journal of Metals and Materials 2018;56(5): 366-374. doi: https://doi.org/10.3365/KJMM.2018.56.5.366
Effect of Sn Content on Filler and Bonding Characteristics of Active Metal Brazed Cu/Al2O3 Joint
Jioh Shin1, Ashutosh Sharma2, Do-hyun Jung1, Jae Pil Jung1
1Department of Materials Science and Engineering, University of Seoul, Seoul 02504, Republic of Korea
2Department of Energy Systems Research, Ajou University, Suwon 16499, Republic of Korea
Correspondence  Jae Pil Jung ,Tel: +82-2-6490-2408, Email: jpjung@uos.ac.kr
Received: 10 January 2018;  Accepted: 6 March 2018.  Published online: 8 May 2018.
This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/ Al2O3 joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and a Cu-rich phase, and Cu-Ti intermetallic compounds were observed along the bonded interface. The intermetallic compounds (IMCs) in the filler are found to increase when the Sn content in the alloy approaches to 10 wt%. These results suggest an extremely significant bonding strength of Cu/Al2O3 joint using the Ag-Cu-Ti+Sn filler. The shear strength of the brazed joint increased with Sn content up to 5 wt%, reaching a maximum at ≈15 MPa. In addition, the strength decreased when the Sn content was higher than 5 wt%.
Keywords: metal, active brazing, diffusion, intermetallic compounds, alumina.
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