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Korean J. Met. Mater.
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MPSA와 PEG 첨가 조건에 따른 전해동박의 특성 변화
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박종재, 윤준서, 우태규, 박일송
Korean J. Met. Mater.
2025;63(3):210-216. Published online 2025 Mar 5
DOI:
https://doi.org/10.3365/KJMM.2025.63.3.210
Abstract
This study evaluated the effects of various amounts of MPSA and PEG on the surface properties, crystal structure, and mechanical properties of electrolytic copper foil, and PVP was used as an eco-friendly leveler. As the amount of MPSA increased, protrusions and dents were observed on the surface, which did not.....
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고전류밀도 구리전해도금에서 폴리에틸렌글리콜 및 염화이온의 영향 연구
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윤준서, 우태규, 박일송
Korean J. Met. Mater.
2024;62(12):954-962. Published online 2024 Nov 29
DOI:
https://doi.org/10.3365/KJMM.2024.62.12.954
Abstract
To determine the effect of Polyethylene Glycol(PEG) and Chloride ions(Cl-) as additives during electroplating, this study used interaction plots of various characteristics of the electroplated Cu foils for analyses. Crystals of about 2 µm in size were observed on the surface of Cu electroplated in the electrolyte without PEG. When.....
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Web of Science 1
Crossref 1
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고신뢰성 적층 세라믹 커패시터를 위한 침식방지형 주석도금액 개발
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구본일, 김준성, 손유진, 민경석, 백성현
Korean J. Met. Mater.
2024;62(3):180-189. Published online 2024 Mar 5
DOI:
https://doi.org/10.3365/KJMM.2024.62.3.180
Abstract
Capacitors not only store and release electricity but selectively conduct alternating current. Among the various types of capacitors, multi-layer ceramic capacitors (MLCCs) have been widely used in automotive, smartphone, and wearable devices because of their compact size and high capacitance capabilities. In this study, we have developed an electrolyte for.....
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고전류밀도에서의 탄산칼륨 첨가제의 전해동박 특성에 미치는 영향
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우태규, 박일송
Korean J. Met. Mater.
2023;61(5):347-354. Published online 2023 Apr 20
DOI:
https://doi.org/10.3365/KJMM.2023.61.5.347
Abstract
The amount and kind of additives in electrolytes play a very important role on the electroplating of Cu foil, which is used as a cathode materials for secondary batteries. As the use of Cu foil increased, various studies on the electroplated Cu foil are urgently needed. We studied surface characteristics.....
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Web of Science 1
Crossref 2
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아연치환체의 무기산 침출액에서 선택적 환원에 의한 고순도 팔라듐금속의 회수
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송시정, Viet Nhan Hoa Nguyen, 이만승
Korean J. Met. Mater.
2022;60(11):837-844. Published online 2022 Oct 31
DOI:
https://doi.org/10.3365/KJMM.2022.60.11.837
Abstract
A small amount of Pd(II) present in spent electroplating solutions is concentrated by cementation. In this work, a process was developed to recover pure palladium metal by selective reduction from the hydrochloric and the sulfuric acid leaching solutions of cemented zinc. For this purpose, hydrazine and ascorbic acid were employed.....
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Web of Science 2
Crossref 2
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Korean J. Met. Mater.
2022;60(5):370-375. Published online 2022 Apr 22
DOI:
https://doi.org/10.3365/KJMM.2022.60.5.370
Abstract
Kerfless wafering is a beneficial technique that enhances the cost effectiveness of crystalline silicon (c-Si) solar cells, preventing silicon (Si) waste during diamond sawing. This study compared the advantages of three stress layers for kerfless wafering: aluminum (Al) paste, epoxy-, and electroplated nickel (Ni). These materials demonstrated the ability to.....
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도금폐액에 함유된 팔라듐의 아연치환물 염산침출액에서 상용화추출제를 이용한 용매추출로 팔라듐(II)과 아연(II)의 분리
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송시정, Viet Nhan Hoa Nguyen, 이만승
Korean J. Met. Mater.
2022;60(3):188-197. Published online 2022 Feb 8
DOI:
https://doi.org/10.3365/KJMM.2022.60.3.188
Abstract
The demand for palladium (Pd) has increased and this has made it necessary to recover pure Pd from diverse secondary resources. To recover the small amount of Pd(II) present in spent electroplating solutions, Pd(II) is concentrated by cementation with zinc metal. In this work, a hydrometallurgical process consisting of leaching.....
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Web of Science 5
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황산용액에서 상용화 추출제에 의한 팔라듐(II)과 아연(II)의 분리
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송시정, Viet Nhan Hoa Nguyen, 이만승
Korean J. Met. Mater.
2022;60(2):132-140. Published online 2022 Jan 12
DOI:
https://doi.org/10.3365/KJMM.2022.60.2.132
Abstract
Spent electroplating solutions contain a small amount of Pd(II). This Pd(II) can be concentrated by cementation with zinc metal powder. In order to recover pure palladium, a hydrometallurgical process consisting of leaching followed by solvent extraction was developed in this work. First, suitable extractants for the selective extraction of Pd(II).....
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Web of Science 2
Crossref 2
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JGB 첨가제에 의한 동박의 미세구조변화와 전기적 특성
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우태규, 박일송
Korean J. Met. Mater.
2021;59(6):404-411. Published online 2021 May 26
DOI:
https://doi.org/10.3365/KJMM.2021.59.6.404
Abstract
Extremely thin film high quality copper foil is required to ensure high performance in electronics and slimness in secondary batteries. During the electroplating of copper foil, Janus Green B(JGB) and Collagen were introduced as additives to the electrolytes to study their effects. The structural and electrical properties of the electroplated.....
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Web of Science 5
Crossref 6
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고전류밀도에서의 첨가제 초기 거동 및 동박의 기계적 특성
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우태규, 박종재, 박일송
Korean J. Met. Mater.
2021;59(5):304-313. Published online 2021 Apr 6
DOI:
https://doi.org/10.3365/KJMM.2021.59.5.304
Abstract
In this study, we studied the surface and mechanical properties of multiple additives as well as the initial plating properties of individual additives. With the individual additive groups, copper crystals tended to converge at a stage above the critical amount of additive. When chloride ions were added, large crystals formed.....
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Web of Science 5
Crossref 4
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Sn 도금을 통한 PCB 기판상의 솔더 범프 제작 및 미세조직 분석
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김상혁, 김성진, 신한균, 박현, 허철호, 문성재, 이효종
Korean J. Met. Mater.
2021;59(4):233-238. Published online 2021 Mar 24
DOI:
https://doi.org/10.3365/KJMM.2021.59.4.233
Abstract
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM.....
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Web of Science 2
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고전류밀도에서 유기첨가제에 의한 구리 전착층의 전기적 특성 변화
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우태규, 박일송
Korean J. Met. Mater.
2020;58(1):41-48. Published online 2019 Dec 12
DOI:
https://doi.org/10.3365/KJMM.2020.58.1.41
Abstract
Electroplating has many economic advantages in producing copper foils. The easiest way to manufacture electroplated copper foil with various properties is to add appropriate additives. This study evaluated the surface properties, mechanical and electrical properties of copper foil electroplated in electrolytes containing the leveler JGB (Janus Green B). When the.....
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Web of Science 9
Crossref 6
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3가 크롬 도금욕에서 펄스 도금의 전기화학적 변수 최적화를 통한 크롬 도금막의 내식성 향상 연구
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임채원, 임동욱, 구본일, 심상은, 백성현
Korean J. Met. Mater.
2019;57(10):641-647. Published online 2019 Sep 6
DOI:
https://doi.org/10.3365/KJMM.2019.57.10.641
Abstract
Electroplating chromium films in a trivalent chromium bath has been extensively investigated as a replacement for the conventional hexavalent chromium bath. However, commercialization of the trivalent chromium method has been hindered because the resulting chromium films exhibit inferior mechanical properties compared to hexavalent chromium coated film. In this study, we.....
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Web of Science 2
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젤라틴 및 염소이온 첨가에 의한 구리 박막의 미세조직 및 기계적 특성 고찰
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우태규, 이만형, 설경원
Korean J. Met. Mater.
2018;56(7):518-523. Published online 2018 Jul 5
DOI:
https://doi.org/10.3365/KJMM.2018.56.7.518
Abstract
This study investigated the crystal structure and mechanical properties of copper foil electroplated by adjusting gelatin and chloride ions from 0 to 100 ppm. There was increased formation of spherical crystals and surface roughness on the surface of the electroplated layer when the gelatin was added, and the direction of.....
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Crossref 6
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구리 전해도금 변수의 기계적 특성 및 표면 특성에 미치는 주 효과 분석
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우태규, 박일송, 설경원
Korean J. Met. Mater.
2018;56(6):459-464. Published online 2018 Jun 4
DOI:
https://doi.org/10.3365/KJMM.2018.56.6.459
Abstract
Electroplated copper has been used as wiring in electronic circuit boards and as cathode materials for secondary batteries, and its usage has expanded into the construction industry because of its convenient production and high economic value. During the electroplating process, various parameters, such as crystal phase and size, can affect.....
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Crossref 1
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Korean J. Met. Mater.
2018;56(6):449-458. Published online 2018 Jun 4
DOI:
https://doi.org/10.3365/KJMM.2018.56.6.449
Abstract
In this study, the extrusion behavior of Cu fill material in a through-Si-via (TSV) subjected to thermal loading was investigated. The Cu filling of the TSV was accomplished using pulse periodic reverse (PPR) electroplating. To study the extrusion, TSVs of varying via pitch were filled with Cu by electroplating. Defect-free Cu.....
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Crossref 5
Electronic Materials
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전해 동박의 표면 형상 및 기계적 물성에 미치는 SPS 첨가제 영향
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우태규
Korean J. Met. Mater.
2016;54(9):681-687. Published online 2016 Sep 5
DOI:
https://doi.org/10.3365/KJMM.2016.54.9.681
Abstract
In this study the effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) on the elongation, surface morphology and crystal structure of electrolytic copper foil were investigated. Additives HEC (hydroxyethyl cellulose) (A), SPS(B), Coll-A(C) were used in the study, and the additive used as D was a Cl- ion. The study results show that there.....
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Crossref 5
Corrosion & Surface Treatment
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금도금의 전류효율에 미치는 과황산칼륨 첨가의 영향
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손인준, 손호상, 김경태
Korean J. Met. Mater.
2016;54(9):652-658. Published online 2016 Sep 5
DOI:
https://doi.org/10.3365/KJMM.2016.54.9.652
Abstract
In this study, the effect of potassium persulfate on current efficiency for gold plating was investigated using electrochemical techniques. The current efficiency in the low-current-density range greatly decreased when potassium persulfate was added to the gold plating solution. However, the current efficiency in the high-current-density range did not change with.....
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Crossref 1
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